China Shenzhen Hongxinteng Technology Co., Ltd. Company cases

Electronics Production Machinery THT Automation Insertion Machine for DIP assembly line

Industry Pain Points The traditional manual insertion the problems of low assembly efficiency, poor line balance and high manual dependence, which makes it difficult for enterprises to cope with large quantities of orders. Non-standard product production process tracking difficulties. Therefore, we launched a fully automatic insertion machine to improve production efficiency and quality control.The insertion accuracy (such as the theoretical insertion speed of 0.16 s/point) is improved by automatic equipment, and the manual operation error is reduced.Realize the linkage of intelligent warehousing system and production line, optimize the efficiency of supply chain collaboration, and shorten the delivery cycle. Scheme designModular hardware layoutThe design adopts block stacked structure, and divides the function modules such as rack assembly, electrical component installation and debugging area to reduce the problem of equipment interference hole.Support special-shaped insertion machine customization, adapt to LED, automotive electronics and other industries production needs. Intelligent IntegrationIntegration of PLC control, AGV logistics system and cloud monitoring platform, to achieve automatic loading and unloading and closed-loop production.Through the lightweight touch screen to simplify the operation interface, reduce the cost of staff training, improve the efficiency of human-computer interaction. Process optimization Secondary processing standards: after plating hole slot cleanliness, heat treatment process strict control, to ensure the assembly accuracy.Sensor and high-precision cylinder are introduced to improve the anti-vibration ability and frequency characteristics of the insertion and prolong the service life of the equipment. Implementation steps and process analysisIdentify production line bottlenecks (e. g. Line balancing rate less than 65%) and develop phased assembly and commissioning plans.Outsourcing parts dynamic tracking: through the ERP system to monitor the electroplating, chamfering and other secondary processing progress. Assembly and commissioning The assembly of the frame, the bottom plate, the sensor and other components is completed step by step, and the matching degree of the holes is verified by manual debugging.Through the PLC program to optimize the timing of action to achieve a smooth transition from manual to automatic. Validation Comparison data: THT insertion machine line balance rate increased to 90% , single line capacity doubled, defective rate decreased by 30% .Output standard file: contains SOP operation manual, maintenance guide and fault response process.Iv. Presentation of resultsImproving efficiency and quality The DIP insertion machine saves 1656 seconds per day, and the production cycle is shortened by 25% to meet the large-scale delivery needs of products such as fast charging sources.The consistency of components is improved, the anti-vibration performance of products is enhanced, and it is suitable for high-demand scenarios such as automotive electronics. Cost Optimization The labor cost is reduced by 30% , the material loss is reduced by 18% , and the equipment failure response time is reduced by 40% .Through the intelligent storage system to achieve dynamic management of spare parts inventory, reduce capital occupation. Industry value The formation of reusable whole line design standards, covering mobile phone chargers, LED lighting, home appliances, industrial equipment instrumentation, and other categories of production.To promote the"Smart + quality" upgrade, cooperation customers include Guangbao Electronics, Huafeng Electronics and more than 30 Head Enterprises

2025-03-11

SMT assembly line LED mounter /DOB Placement Production line

Illumadyne, Inc.(USA)build a SMT line based on Seoul Tong HCT-610LV Smt Mounter to increase the production capacity of high-capacity LED panels and DOB products, support L600 × W500 mm large size substrate and automatic nozzle switching function, the goal is to achieve an average daily production capacity of ≥200,000 points, and meet the high-precision placement requirements of the LED industry. Equipment selection and layout of whole line configuration scheme. Core equipment:HCT-610LV pick and place machine × 2 setsTheoretical capacity: stand-alone 15,000 CPH/hour (Dob Mount Mode) , LED chip up to 40,000 CPH/hour to support automatic mouth function, compatible with 0402 to 20 × 20 mm componentsSubstrate processing: maximum support L600 × W500 MM substrate, dual track asynchronous production, line change time ≤15 minutes Supporting equipment:Printing section: HXT H6 automatic solder paste printing machine + HXT reflow ovenTransmission system: automatic vacuum suction plate machine + intelligent connection table‌Intelligent System IntegrationNozzle management: configuration of 10 sets of nozzle library, support automatic switch to adapt to different component typesData Monitoring: real-time collection of placement offset (± 0.05 mm) , throwing rate (≤0.05%) and other parameters to generate production reports Indicators Details of parameters Mounting speed Single 15,000 CPH (DOB mode) , the whole line peak capacity of 40,000 CPH Precision of placement ± 0.05 mm (Chip element@3Σ standard) Compatibility of components 0402 to 20 × 20 mm components, support DOB lamp beads, special-shaped lens mount Dimension of substrate Maximum L600 × W500 MM, minimum 50 × 50 mm Efficiency of line changing Suction nozzle automatic switching + dual-track asynchronous feeding, line change time than traditional models shortened by 50% 8 Application scenarios LED lightingProduct type: large size lamp board, DOB Driver Board.Technical Requirements: l600 mm long board continuous mounting, support lens and lamp beads synchronous mounting. Consumer ElectronicsProduct type: Intelligent Lamp Control Panel.Technical requirements: daily average capacity ≥200,000 points, placement accuracy ± 0.05 mm. Measured Effectiveness DataOperation rate: ≥92% (including line change and material switching time)Average daily capacity: 22 hours continuous production up to 220,000 points. Summary of the value of the programEfficiency Advantage: dual track asynchronous production + automatic nozzle change technology, comprehensive efficiency increased by 40%Precision Guarantee: high rigid mechanical structure + visual positioning compensation, to meet the needs of precision placement LED industryExpansion capacity: support l600 mm large board and DOB process, adapt to the intelligent lamps and lanterns upgrade requirements. Points to note for implementationEnvironmental requirements: temperature 25 ± 5 °C, humidity 40-70% Rh, to avoid dust interference optical positioning system.Maintenance specification: suction nozzle library every 200 hours clean calibration, guide lubrication weekly maintenance.

2025-03-10

SMT full automatic production line of LED Display Samsung SM482/SMT481 Mounter

ALUDECOR Lamination Pvt. Ltd. . In order to meet the requirements of the IATF16949 standard, it is necessary to build an LED display production line which is compatible with large size substrate (L1100 × W460 MM) and special-shaped components (BGA, QFN) . Core equipment selection and layout of the whole line configuration scheme. High-speed placement section:Samsung SM482 mounter × 1 setTheoretical capacity: 42,000 CPH (IPC9850 standard) , support 0402 to □14 mm components, double cantilever structure to achieve zero seconds PCB handlingConfiguration: 6 suction nozzles × 2 cantilevers, integrated FlyVision system, dynamic element position compensation support Multi-function mounting section:Samsung SM481 mounter × 1 setTheoretical capacity: 39,000 CPH, supports 0402 to □16 mm components and BGA/CSP (ball pitch ≥0.4 mm) Configuration: 10-axis single stand, optional fixed visual recognition module to improve accuracy to ± 30μm (QFP element) Supporting equipment:Printing section: GKG H1500 automatic solder paste printing machine + SINIC-TEK 3D SPI detection system -LRB-accuracy 0.25 mm) Curing test section: JT TEA-800 reflow soldering machineTransmission system: automatic loading and unloading machine + intelligent docking station‌ Core performance parameters Indicators SM482 parameter SM481 parameter Mounting speed 42,000 CPH (0402 elements) 39,000 CPH (QFP components) Precision of placement ±50µm (Chip Component@3σ) ±30µm (QFP component@3σ) Compatibility of components 0402 to □14 mm (including profiled elements) 0402 to □16 mm (BGA/CSP supported) Substrate handling capability L510 × W460MM (dual track asynchronous production) L510 × W460MM (monorail) Application scenarios and measured results Led Luminaires: LED driver (support LED chip DOB mount) LED display: P1-P10 components (compatible with 1200 mm long board continuous mounting) Measured dataFull line peak capacity: 81,000 points/hr (SM482 + SM481 combination) Operation rate: ≥93% (including automatic refueling and program switching) Summary of the value of the programEfficiency Advantage: double cantilever structure and double track asynchronous production, line change time is reduced by 40% Precision Guarantee: FlyVision dynamic compensation + fixed vision module, suitable for high-density PCB placementScalability: supports L510 × W460 mm substrates with 0.4 mm ball pitch BGA, suitable for next 3 product iterations Points to note for implementationEnvironmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical vibration accuracyMaintenance Specification: Mount Head every 500 hours calibration, guide rail monthly cleaning lubrication

2025-03-10

SMT machine automatic production line for Electronic Product Engineering and Electronics Manufacturing

Argus Embedded Systems Pvt Ltd. (India) for Electronic Product Engineering Services and Electronics Manufacturing Services, build SMT line based on Juki RS-1R SMT Mounter, compatible with 0201 micro components to 74 mm large size profiled components, to meet the IATF16949 standard and daily average production capacity ≥180 million CPH of production requirements. The whole line configuration scheme, equipment selection and layout Core mounting equipment:Juki RS-1R mounter × 2 setsTheoretical capacity: single 47,000 CPH (the best conditions) , the whole line peak capacity of 94,000 points/hourSubstrate handling: supports up to 1200 × 370 mm substrates (twice splint mode) , compatible with dual track asynchronous productionComponent compatibility: 0201(008004 inch) to 74 mm profiled components, mount height ≤25 mm Supporting equipment:Printing section: GKG Gls-e fully automatic solder paste printing machine + SINIC-TEK 3D SP solder paste inspection machine (detection accuracy 0.25 mm) Curing test section: SINIC-TEK 3D Online Aoi Test + JT reflow solderingTransmission system: automatic loading and unloading machine + intelligent docking station Intelligent system integrationNetwork control: through the LAN to achieve equipment program sharing and remote monitoring (IP address configuration compatible factory network) Data Management: real-time collection of placement accuracy (± 0.035 mm) , equipment operating rate and other parameters, to generate production reports Core performance parameters Indicators Details of parameters Mounting speed Single machine 47,000 CPH, the whole line theoretical peak capacity of 94,000 points/hour Precision of placement Laser recognition ± 0.035 mm (CPK ≥1) , image recognition ± 0.03 mm (optional precision camera) Dimension of substrate Maximum 1200 × 370 mm (twice splint) , minimum 50 × 50 mm Compatibility of components 0201 chip, 74 mm special-shaped components (such as BGA, QFN) , supporting 50 × 150 mm long size components Efficiency of line changing Double track asynchronous feeding system, 40% reduction in line changing time Typical application scenarios Automotive ElectronicsProduct type: ECU Control Board, on-board Sensor ModuleTechnical Requirements: meet IATF16949 standard, placement accuracy ± 0.035 mm‌Consumer ElectronicsProduct type: UAV Motherboard, LED DisplayTechnical Requirements: support continuous production of 1200 × 370 mm large size substrate, daily average production capacity ≥1.8 million CPH Measured Effectiveness DataOperation rate: ≥95% (including automatic refueling and program switching time)Average daily capacity: 22-hour continuous production reached 1.848 million CPHDefect rate: SPI + Aoi full coverage, defect rate ≤50 ppm Summary of the value of the programEfficiency Improvement: the dual-track asynchronous feeding system reduces downtime, and the overall efficiency is 30% higher than the traditional production linePrecision Guarantee: Laser and image recognition dual-mode, achieve ± 0.03 mm high-precision placementExpansion capacity: support large size substrate and special-shaped components mixed paste, adapt to the next 5 years of product upgrading needs Points to note for implementationEnvironmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical thermal deformation accuracyMaintenance specification: placement head every 500 hours calibration, guide quarterly lubrication maintenance

2025-03-08

SMT fully automatic production line for Automotive Electronics and high-end consumer electronics

‌ BYD car automation company based in China build a SMT line based on Yamaha YSM20 and YSM10 SMT machines to meet the high precision and high capacity requirements of automotive electronics and high-end consumer electronics, compatible with 10 kg heavy substrate and L810 × W490 mm large size substrate production, while meeting the IATF16949 standard certification requirements. The whole line configuration scheme, equipment selection and layout High-speed placement section: 2 sets of YSM20 pick and place machine Theoretical capacity: stand-alone 29 million CPH (optimal conditions) , support L810 × W490 mm substratePlacement head configuration: High-speed Universal HM Placement Head, compatible with 03015 to 45 × 45 mm componentsMulti-functional placement section: 1 YSM10 pick and place machine Support 10 kg heavy-duty substrate, suitable for BGA, QFN and other special-shaped components Auxiliary equipment:GKG G5 Printing machine + SINIC-TEK SPI solder paste testing machine, SINIC-TEK online 3D AOI machine + JT reflow oven Intelligent system integrationNetwork control: through the LAN to achieve the main computer and equipment program sharing IP support remote program transmission and real-time monitoringData Management: collect parameters such as placement offset, equipment operation rate, etc. , and generate production reports Indicators Details of parameters Precision of placement ± 0.025 mm (x/y axis dynamic compensation) , CPK ≥1.0(3σ criterion) Compatibility of components 03015 micro components to 100 × 55 mm large size components, support special-shaped components mix paste Capacity allocation The theoretical peak production capacity of the whole line is 200,000 points/hour (YSM20 × 2 + YSM10 × 1) Substrate handling capability The monorail model supports L810 × W490 MM substrate; the dual-track model supports dual L380 × W490 mm asynchronous production Efficiency of line changing Double track asynchronous feeding system, 40% reduction in line changing time Typical application scenarios Automotive ElectronicsProduct type: ECU Control Board, on-board Sensor ModuleTechnical Requirements: 10 kg heavy-duty substrate mounting accuracy ± 0.035 mm, in line with IATF16949 standard Consumer ElectronicsProduct type: UAV Motherboard, LED DisplayTechnical Requirements: L700 × W460 mm large size substrate continuous placement, daily average capacity ≥1.8 million points Measured Effectiveness DataOperation rate: ≥95% (including automatic refueling and program switching time)Average daily production capacity: 22 hours of continuous production reached 1848000CPH Defect rate: SPI + Aoi full coverage, defect rate ≤50 ppm Summary of the value of the programEfficiency Improvement: the dual-track asynchronous feeding system reduces downtime, and the overall efficiency is 30% higher than the traditional production linePrecision Guarantee: Hawkeye 3.0 Vision System + dynamic compensation technology to achieve ± 0.025 mm stable placementExpandability: support dual-track configuration and special-shaped components placement, to meet the next 5 years of product upgrading needs Points to note for implementationEnvironmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical thermal deformation accuracyMaintenance specification: placement head every 500 hours calibration, guide quarterly lubrication maintenance

2025-01-16

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

PCB Loader And Unloader

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine