BYD car automation company based in China build a SMT line based on Yamaha YSM20 and YSM10 SMT machines to meet the high precision and high capacity requirements of automotive electronics and high-end consumer electronics, compatible with 10 kg heavy substrate and L810 × W490 mm large size substrate production, while meeting the IATF16949 standard certification requirements.
The whole line configuration scheme, equipment selection and layout
High-speed placement section: 2 sets of YSM20 pick and place machine
Theoretical capacity: stand-alone 29 million CPH (optimal conditions) , support L810 × W490 mm substrate
Placement head configuration: High-speed Universal HM Placement Head, compatible with 03015 to 45 × 45 mm components
Multi-functional placement section: 1 YSM10 pick and place machine
Support 10 kg heavy-duty substrate, suitable for BGA, QFN and other special-shaped components
Auxiliary equipment:
GKG G5 Printing machine + SINIC-TEK SPI solder paste testing machine, SINIC-TEK online 3D AOI machine + JT reflow oven
Intelligent system integration
Network control: through the LAN to achieve the main computer and equipment program sharing IP support remote program transmission and real-time monitoring
Data Management: collect parameters such as placement offset, equipment operation rate, etc. , and generate production reports
| Indicators |
Details of parameters |
| Precision of placement |
± 0.025 mm (x/y axis dynamic compensation) , CPK ≥1.0(3σ criterion) |
| Compatibility of components |
03015 micro components to 100 × 55 mm large size components, support special-shaped components mix paste |
| Capacity allocation |
The theoretical peak production capacity of the whole line is 200,000 points/hour (YSM20 × 2 + YSM10 × 1) |
| Substrate handling capability |
The monorail model supports L810 × W490 MM substrate; the dual-track model supports dual L380 × W490 mm asynchronous production |
| Efficiency of line changing |
Double track asynchronous feeding system, 40% reduction in line changing time |
Typical application scenarios
Automotive Electronics
Product type: ECU Control Board, on-board Sensor Module
Technical Requirements: 10 kg heavy-duty substrate mounting accuracy ± 0.035 mm, in line with IATF16949 standard
Consumer Electronics
Product type: UAV Motherboard, LED Display
Technical Requirements: L700 × W460 mm large size substrate continuous placement, daily average capacity ≥1.8 million points
Measured Effectiveness Data
Operation rate: ≥95% (including automatic refueling and program switching time)
Average daily production capacity: 22 hours of continuous production reached 1848000CPH
Defect rate: SPI + Aoi full coverage, defect rate ≤50 ppm
Summary of the value of the program
Efficiency Improvement: the dual-track asynchronous feeding system reduces downtime, and the overall efficiency is 30% higher than the traditional production line
Precision Guarantee: Hawkeye 3.0 Vision System + dynamic compensation technology to achieve ± 0.025 mm stable placement
Expandability: support dual-track configuration and special-shaped components placement, to meet the next 5 years of product upgrading needs
Points to note for implementation
Environmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical thermal deformation accuracy
Maintenance specification: placement head every 500 hours calibration, guide quarterly lubrication maintenance
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