Argus Embedded Systems Pvt Ltd. (India) for Electronic Product Engineering Services and Electronics Manufacturing Services, build SMT line based on Juki RS-1R SMT Mounter, compatible with 0201 micro components to 74 mm large size profiled components, to meet the IATF16949 standard and daily average production capacity ≥180 million CPH of production requirements.
The whole line configuration scheme, equipment selection and layout
Core mounting equipment:
Juki RS-1R mounter × 2 sets
Theoretical capacity: single 47,000 CPH (the best conditions) , the whole line peak capacity of 94,000 points/hour
Substrate handling: supports up to 1200 × 370 mm substrates (twice splint mode) , compatible with dual track asynchronous production
Component compatibility: 0201(008004 inch) to 74 mm profiled components, mount height ≤25 mm
Supporting equipment:
Printing section: GKG Gls-e fully automatic solder paste printing machine + SINIC-TEK 3D SP solder paste inspection machine (detection accuracy 0.25 mm)
Curing test section: SINIC-TEK 3D Online Aoi Test + JT reflow soldering
Transmission system: automatic loading and unloading machine + intelligent docking station
Intelligent system integration
Network control: through the LAN to achieve equipment program sharing and remote monitoring (IP address configuration compatible factory network)
Data Management: real-time collection of placement accuracy (± 0.035 mm) , equipment operating rate and other parameters, to generate production reports
Core performance parameters
| Indicators |
Details of parameters |
| Mounting speed |
Single machine 47,000 CPH, the whole line theoretical peak capacity of 94,000 points/hour |
| Precision of placement |
Laser recognition ± 0.035 mm (CPK ≥1) , image recognition ± 0.03 mm (optional precision camera) |
| Dimension of substrate |
Maximum 1200 × 370 mm (twice splint) , minimum 50 × 50 mm |
| Compatibility of components |
0201 chip, 74 mm special-shaped components (such as BGA, QFN) , supporting 50 × 150 mm long size components |
| Efficiency of line changing |
Double track asynchronous feeding system, 40% reduction in line changing time |
Typical application scenarios
Automotive Electronics
Product type: ECU Control Board, on-board Sensor Module
Technical Requirements: meet IATF16949 standard, placement accuracy ± 0.035 mm
Consumer Electronics
Product type: UAV Motherboard, LED Display
Technical Requirements: support continuous production of 1200 × 370 mm large size substrate, daily average production capacity ≥1.8 million CPH
Measured Effectiveness Data
Operation rate: ≥95% (including automatic refueling and program switching time)
Average daily capacity: 22-hour continuous production reached 1.848 million CPH
Defect rate: SPI + Aoi full coverage, defect rate ≤50 ppm
Summary of the value of the program
Efficiency Improvement: the dual-track asynchronous feeding system reduces downtime, and the overall efficiency is 30% higher than the traditional production line
Precision Guarantee: Laser and image recognition dual-mode, achieve ± 0.03 mm high-precision placement
Expansion capacity: support large size substrate and special-shaped components mixed paste, adapt to the next 5 years of product upgrading needs
Points to note for implementation
Environmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical thermal deformation accuracy
Maintenance specification: placement head every 500 hours calibration, guide quarterly lubrication maintenance
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