ALUDECOR Lamination Pvt. Ltd. . In order to meet the requirements of the IATF16949 standard, it is necessary to build an LED display production line which is compatible with large size substrate (L1100 × W460 MM) and special-shaped components (BGA, QFN) .
Core equipment selection and layout of the whole line configuration scheme.
High-speed placement section:
Samsung SM482 mounter × 1 set
Theoretical capacity: 42,000 CPH (IPC9850 standard) , support 0402 to □14 mm components, double cantilever structure to achieve zero seconds PCB handling
Configuration: 6 suction nozzles × 2 cantilevers, integrated FlyVision system, dynamic element position compensation support
Multi-function mounting section:
Samsung SM481 mounter × 1 set
Theoretical capacity: 39,000 CPH, supports 0402 to □16 mm components and BGA/CSP (ball pitch ≥0.4 mm)
Configuration: 10-axis single stand, optional fixed visual recognition module to improve accuracy to ± 30μm (QFP element)
Supporting equipment:
Printing section: GKG H1500 automatic solder paste printing machine + SINIC-TEK 3D SPI detection system -LRB-accuracy 0.25 mm)
Curing test section: JT TEA-800 reflow soldering machine
Transmission system: automatic loading and unloading machine + intelligent docking station
Core performance parameters
| Indicators |
SM482 parameter |
SM481 parameter |
| Mounting speed |
42,000 CPH (0402 elements) |
39,000 CPH (QFP components) |
| Precision of placement |
±50µm (Chip Component@3σ) |
±30µm (QFP component@3σ) |
| Compatibility of components |
0402 to □14 mm (including profiled elements) |
0402 to □16 mm (BGA/CSP supported) |
| Substrate handling capability |
L510 × W460MM (dual track asynchronous production) |
L510 × W460MM (monorail) |
Application scenarios and measured results
Led Luminaires: LED driver (support LED chip DOB mount)
LED display: P1-P10 components (compatible with 1200 mm long board continuous mounting)
Measured data
Full line peak capacity: 81,000 points/hr (SM482 + SM481 combination)
Operation rate: ≥93% (including automatic refueling and program switching)
Summary of the value of the program
Efficiency Advantage: double cantilever structure and double track asynchronous production, line change time is reduced by 40%
Precision Guarantee: FlyVision dynamic compensation + fixed vision module, suitable for high-density PCB placement
Scalability: supports L510 × W460 mm substrates with 0.4 mm ball pitch BGA, suitable for next 3 product iterations
Points to note for implementation
Environmental requirements: temperature 23 ± 3 °C, humidity 50 ± 10% Rh, to avoid mechanical vibration accuracy
Maintenance Specification: Mount Head every 500 hours calibration, guide rail monthly cleaning lubrication
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