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High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

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High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

Brand Name:	rmi
Model Number:	X-7900Ultra
MOQ:	1 pcs
Price:	173200 USD
Packaging Details:	Wodden box
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Product Name:

X-7900 Ultra Offline X-Ray Inspection Machine

Machine Type:

Nano Focus Industrial X-Ray Inspection System

Application:

PCB, PCBA, SMT And BGA Solder Joint Inspection

X-Ray Tube Voltage:

160 KV

Spatial Resolution:

Inspection Technology:

Digital Flat Panel X-Ray Imaging

Measurement Function:

Solder Void Ratio, Void Size And Solder Climbing Height Measurement

Optional CT Technology:

Planar CT And Cone Beam CT

Supply Ability:

1000 pcs per month

Highlight:

Nano-Focus X-Ray Inspection System

3D CT X-Ray Inspection Machine

160kV X-Ray Inspection System

Product Description

The RMI 3DiCT X-7900 Ultra Nano-Focus X-Ray Inspection System is an industrial X-ray inspection machine built to examine the internal structure of electronic components, solder joints, and printed circuit boards (PCBs) without damaging the samples.

It is especially suited to electronics manufacturing, SMT production lines, semiconductor inspection, and quality-control laboratories.

Technical Specifications

Category	Specification	X-7900 Ultra
Tube	Model	X-7900 Ultra
	Tube type	Open tube
	Target power	15 W / Diamond Target
	Spatial resolution	1 μm
	Tube voltage	160 kV
FPD	Image taking type	Flat-panel Digital
	Imaging precision	49.8 μm
	A/D convert quantified density value	16 bit (65536)
	Dpi	2340 * 2882 px
	Frame frequency	9 FPS
	Tube current	500 μA
System	Optical magnification	2000X
	System magnification	7500X
	Operating system	Windows 11
	Power supply	AC 110–220 V, 50–60 Hz
	Power	1200 W
	Radiation safety test	<1 μSv/h
Structure	FPD tilt angle	±70°
	Stage size	670 mm * 670 mm
	Sensing range	600 mm * 600 mm
	Load-bearing	≤10 kg
	Machine size	1578 * 1675 * 2265 mm (L * W * H)
	Machine weight	2200 kg
	Stage movement	Automatic / manual
CT	Planar CL	CL sampling diameter: 530 mm
	Cone beam CT	CT sampling diameter: 60 mm
	Inspection area size	Planar CT 300 * 300 mm; Cone beam CT 60 * 240 mm
	CT accuracy	1 μm, 5 μm, 15 μm, 100 μm
	Min. imaging time (tomography)	18 s
	Min. reconstruction time	30 s
Safety	CE Certificate	Yes: STE23113101S
Safety	Radiation Safety Permit	Yes

Main Functions

Function	What It Does
Array function	Automatically inspects multiple samples at predefined positions and spacing.
Void measurement	Measures void size, void ratio, and solder climbing height.
Visual navigation	Helps operators locate specific inspection areas accurately.
High-resolution X-ray imaging	Produces detailed images of internal structures.
Tilted observation	Supports observation at angles up to ±70°, according to the supplied specifications.
360° rotating stage	Allows samples to be rotated for inspection from different directions.
AI measurement	Optional automatic defect measurement and analysis.
Dual CT system	Optional 3D inspection using the specified CT configurations.

Key Advantages

Ultra-high inspection precision The X-7900 Ultra is specified with a 1 μm focal spot size, helping it produce highly detailed X-ray images for fine-pitch electronic components and semiconductor inspection.
Detects hidden soldering defects It helps identify voids, incomplete solder connections, and other internal defects that ordinary optical inspection cannot directly see.
Automatic measurement and analysis Array inspection and measurement tools reduce repetitive manual work and help operators obtain more consistent inspection results.
Optional 3D CT inspection With the appropriate CT configuration, the machine can reconstruct internal structures in three dimensions, helping engineers investigate complex defects.
Non-destructive testing Inspect samples without cutting them open, helping preserve valuable PCBs and components during failure analysis.
Flexible inspection angles The specified ±70° detector tilt and 360° sample rotation capability allow inspection from different viewing directions, subject to the installed configuration.

Applications

PCB and SMT inspection: Examine solder joints hidden underneath electronic components.
BGA inspection: Detect soldering defects beneath Ball Grid Array (BGA) packages.
Void detection: Identify air bubbles and voids inside solder joints or other materials.
Solder joint analysis: Measure void ratio, void size, and solder climbing height.
Component inspection: Check the internal structure of electronic components for defects.
3D CT inspection: Reconstruct internal structures in three dimensions when the optional CT system is installed.
Research and quality control: Analyze samples and identify manufacturing defects.

pcb aoi machine

3d aoi machine

automated optical inspection equipment

Products Details

Home > Products >

SMT AOI Machine

High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

All Category

High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

Brand Name:	rmi
Model Number:	X-7900Ultra
MOQ:	1 pcs
Price:	173200 USD
Packaging Details:	Wodden box
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Brand Name:

rmi

Certification:

Model Number:

X-7900Ultra

Product Name:

X-7900 Ultra Offline X-Ray Inspection Machine

Machine Type:

Nano Focus Industrial X-Ray Inspection System

Application:

PCB, PCBA, SMT And BGA Solder Joint Inspection

X-Ray Tube Voltage:

160 KV

Spatial Resolution:

1 μm

Inspection Technology:

Digital Flat Panel X-Ray Imaging

Measurement Function:

Solder Void Ratio, Void Size And Solder Climbing Height Measurement

Optional CT Technology:

Planar CT And Cone Beam CT

Minimum Order Quantity:

1 pcs

Price:

173200 USD

Packaging Details:

Wodden box

Delivery Time:

15 working days

Payment Terms:

T/T

Supply Ability:

1000 pcs per month

Highlight:

Nano-Focus X-Ray Inspection System

3D CT X-Ray Inspection Machine

160kV X-Ray Inspection System

Product Description

It is especially suited to electronics manufacturing, SMT production lines, semiconductor inspection, and quality-control laboratories.

Technical Specifications

Category	Specification	X-7900 Ultra
Tube	Model	X-7900 Ultra
	Tube type	Open tube
	Target power	15 W / Diamond Target
	Spatial resolution	1 μm
	Tube voltage	160 kV
FPD	Image taking type	Flat-panel Digital
	Imaging precision	49.8 μm
	A/D convert quantified density value	16 bit (65536)
	Dpi	2340 * 2882 px
	Frame frequency	9 FPS
	Tube current	500 μA
System	Optical magnification	2000X
	System magnification	7500X
	Operating system	Windows 11
	Power supply	AC 110–220 V, 50–60 Hz
	Power	1200 W
	Radiation safety test	<1 μSv/h
Structure	FPD tilt angle	±70°
	Stage size	670 mm * 670 mm
	Sensing range	600 mm * 600 mm
	Load-bearing	≤10 kg
	Machine size	1578 * 1675 * 2265 mm (L * W * H)
	Machine weight	2200 kg
	Stage movement	Automatic / manual
CT	Planar CL	CL sampling diameter: 530 mm
	Cone beam CT	CT sampling diameter: 60 mm
	Inspection area size	Planar CT 300 * 300 mm; Cone beam CT 60 * 240 mm
	CT accuracy	1 μm, 5 μm, 15 μm, 100 μm
	Min. imaging time (tomography)	18 s
	Min. reconstruction time	30 s
Safety	CE Certificate	Yes: STE23113101S
Safety	Radiation Safety Permit	Yes

Main Functions

Function	What It Does
Array function	Automatically inspects multiple samples at predefined positions and spacing.
Void measurement	Measures void size, void ratio, and solder climbing height.
Visual navigation	Helps operators locate specific inspection areas accurately.
High-resolution X-ray imaging	Produces detailed images of internal structures.
Tilted observation	Supports observation at angles up to ±70°, according to the supplied specifications.
360° rotating stage	Allows samples to be rotated for inspection from different directions.
AI measurement	Optional automatic defect measurement and analysis.
Dual CT system	Optional 3D inspection using the specified CT configurations.

Key Advantages

Ultra-high inspection precision The X-7900 Ultra is specified with a 1 μm focal spot size, helping it produce highly detailed X-ray images for fine-pitch electronic components and semiconductor inspection.
Detects hidden soldering defects It helps identify voids, incomplete solder connections, and other internal defects that ordinary optical inspection cannot directly see.
Automatic measurement and analysis Array inspection and measurement tools reduce repetitive manual work and help operators obtain more consistent inspection results.
Optional 3D CT inspection With the appropriate CT configuration, the machine can reconstruct internal structures in three dimensions, helping engineers investigate complex defects.
Non-destructive testing Inspect samples without cutting them open, helping preserve valuable PCBs and components during failure analysis.
Flexible inspection angles The specified ±70° detector tilt and 360° sample rotation capability allow inspection from different viewing directions, subject to the installed configuration.

Applications

PCB and SMT inspection: Examine solder joints hidden underneath electronic components.
BGA inspection: Detect soldering defects beneath Ball Grid Array (BGA) packages.
Void detection: Identify air bubbles and voids inside solder joints or other materials.
Solder joint analysis: Measure void ratio, void size, and solder climbing height.
Component inspection: Check the internal structure of electronic components for defects.
3D CT inspection: Reconstruct internal structures in three dimensions when the optional CT system is installed.
Research and quality control: Analyze samples and identify manufacturing defects.

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Electronics Production Machinery

PCB Machine

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

Nano-Focus X-Ray Inspection System

3D CT X-Ray Inspection Machine

160kV X-Ray Inspection System

pcb aoi machine

3d aoi machine

automated optical inspection equipment

Products Details

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

High Precision Nano-Focus 3D CT X-Ray Inspection System and 160kV X-Ray Inspection Machine for PCB SMT BGA Semiconductor

Nano-Focus X-Ray Inspection System

3D CT X-Ray Inspection Machine

160kV X-Ray Inspection System

pcb aoi machine

3d aoi machine

automated optical inspection equipment