The Manual Dry Film Laminator Machine is specialized equipment designed for applying dry-film photoresist to PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit) substrates. It uses a heated roller system with adjustable temperature, pressure, and laminating speed to achieve uniform film adhesion and consistent lamination quality.

This machine is suitable for PCB fabrication workshops, electronics manufacturing facilities, laboratories, and small-to-medium production environments. Its adjustable operating parameters allow users to accommodate different board thicknesses and compatible dry-film materials.

The machine can be used in PCB photolithography processes, where dry-film photoresist is laminated onto the copper surface before exposure, development, and etching. Its dust-removal rollers help reduce surface contamination before lamination, supporting reliable film adhesion and improved process consistency.

In PCB manufacturing, the machine uses heated rollers and adjustable pressure to laminate dry-film photoresist onto the copper surface. The film is then exposed and developed to form the required circuit pattern.

Step 1: Prepare the PCB board

Clean the copper surface and remove dust, oil, and other contaminants.

Step 2: Feed the board into the machine

Feed the PCB and dry film through the heated rollers. The rollers apply controlled heat and pressure to bond the film to the board.

Step 3: Complete lamination

The board exits with a dry-film coating, ready for the next processing stage.

• Uniform Film Lamination: Heated rollers provide consistent heat and pressure for reliable dry-film adhesion.

• Adjustable Temperature: Temperature settings can be adjusted to suit compatible dry-film materials and process requirements.

• Variable Laminating Speed: Adjustable speed supports flexible production and process control.

• Adjustable Pressure: Pressure settings help accommodate different substrate thicknesses and lamination requirements.

• Dust Removal System: Upper and lower adhesive rollers help remove dust particles from the substrate surface.

• Wide Laminating Capacity: A working width of up to 640 mm accommodates suitable PCB panels and other compatible flat materials.

• Compact Industrial Design: Suitable for PCB fabrication facilities, sample production, and small-batch manufacturing.

PCB manufacturing: Laminating dry-film photoresist onto copper-clad boards before exposure and etching.

FPC manufacturing: Applying dry film to flexible circuit materials.

TP processing: Laminating film onto compatible TP materials, as specified by the supplier.

Small-batch production: Suitable for workshops, laboratories, and factories that need manual operation.

For more detail information and good price, please contact us,

Alina
Mobile: +86 16620793861
Email: alina@hxt-smt.com
www.smtpcbmachines.com

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