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3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

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3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

Brand Name:	Snicktek
MOQ:	1
Price:	$28,400

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Machine Type:

SPI Equipment

Product Name:

3D SPI Automatic Machine

Type:

Automatic

Application:

SMT PCB Solder Paste Test

Usage:

SMD LED SMT

Highlight:

High Speed Testing 3D SPI Machine

In-line Inspection Solder Paste Inspection Machine

Five Million Pixels Camera Automatic SPI Equipment

Product Description

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine

A 3D SINICTEK Solder Paste Inspection (SPI) machine is an automated optical inspection (AOI) system designed for the Surface Mount Technology (SMT) assembly line. It uses advanced 3D imaging technology (typically structured light or phase-shift profilometry) to measure the volume, height, area, and alignment of solder paste deposits on a printed circuit board (PCB) before component placement. Its "High-Speed Testing" capability refers to its fast measurement cycle time, allowing it to keep pace with modern high-speed screen printers and pick-and-place machines without becoming a production bottleneck.

Key Features

High-Speed 3D Scanning Technology: Utilizes fast Moiré, phase-shift, or laser scanning to capture millions of data points in seconds, enabling sub-micron height resolution and high repeatability.
True Volumetric Measurement: Calculates the precise volume of each solder paste deposit, which is the most critical parameter for ensuring a reliable solder joint after reflow.
Ultra-Fast Throughput: High-speed cameras, optimized motion control, and efficient algorithms allow for cycle times often under 5-10 seconds per board, matching high-mix or high-volume production needs.
Automatic Programming & Alignment: Features like CAD import, automatic fiducial marking, and component library generation significantly reduce setup time for new products.
Closed-Loop Control Integration: Can communicate directly with solder paste printers (like DEK, Ekra, MPM) to automatically adjust stencil alignment, pressure, or squeegee speed to correct drifting processes in real-time.
Comprehensive Defect Detection: Identifies and classifies a wide range of paste printing defects including:
- Insufficient/Excessive Paste: Low volume/high volume.
- Height Variations: Bridges, insufficient height.
- Shape Defects: Skewing, smear, dog-ears, scooping.
- Presence/Absence: Missing deposits or gross misalignment.
User-Friendly Software: Intuitive GUI with SPC (Statistical Process Control) reporting, real-time dashboards, trend charts (Cp/Cpk), and detailed defect visualization for root cause analysis.
Robust Construction: Designed for 24/7 factory operation with stable granite bases, precision linear guides, and maintenance-friendly designs.

Technical Specifications

Technology Platform	Type-B/C	Type-B/C	Super large platform
Series	Hero/Ultra	Hero/Ultra	1.2m/1.5m series
Model	S8080/S2020/Hero/Ultra	S8080D/S2020D/HeroD/UltraD	L1200/DL1200/DL1500
Measurement Principle	3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Proﬁlometry)
Measurements	Volume, area, height, XY offset, shape
Detection of Non-Performing Types	Missing printing, insufficient tin, excessive tin, bridging tin, offset, poor shape, board surface pollution
Lens Resolution	4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um (Optional for different camera models)
Accuracy	XY (Resolution):10um
Repeatability	height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma);
Gage R&R	<<10%
Inspection Speed	0.35sec/FOV-0.5sec/FOV (Determined according to actual configuration)
Quanlity of Inspection Head	Standard 1, optional 2, 3
Mark-point Detection Time	0.3sec/piece
Maximun Meauring Head	±550um (±1200um as option)
Maximun Measuring Height of PCB Warp	±5mm
Minimun Pad Spacing	100um (pad height is 150um pad as reference) 80um/100um/150um/200um (determined according to actual configuration)
Minimum element	01005/03015/008004 (Optional)	01005/03015/008004 (Optional)	201
Maximun Loading PCB Size(X*Y)	450x500mm(B) 470x500mm (C) (Measurable range 630x550mm Large platform)	450x310+450x310(B) 470x310+470x310(C) 630x310+630x310 (Large platform )	1200x650mm (measurable range 1200x650mm one-stage) 600x2x650mm (Measurable range 1200x550mm two-stage)
Conveyor Setup	front orbit (back orbit as option)	1 front orbit , 2,3,4 Dynamic Orbit	front orbit (back orbit as option)
PCB Transfer Direction	Left to right or Right to left
Conveyor Width Adjustment	manual & automatic
SPC/Engineering Statistics	Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import	Support Gerber format (274x, 274d), manual teach mode, CAD X/Y, Part No., Package Type, etc. import
Operating System Support	Windows 10 Professional (64 bit)
Equipment Diemension and Weight	W1000xD1150xH1530(B), 965Kg W1000xD1174xH1550(C), 985Kg	W1000xD1350xH1530(B) ,1200Kg W1000xD1350xH1550(C) ,1220Kg	W1730xD1420xH1530mm (one-stage), 1630Kg W1900xD1320xH1480mm two-stage), 1250Kg W2030xD1320xH1480(1500), 1450Kg
Optional	1 with multiple centralized control software, network SPC software, 1D/2D Barcode scanner, offline programming software, UPS uninterruptible power supply

Application

SINICTEK SPI machines are essential in modern electronics manufacturing where high first-pass yield is critical. Key application areas include:

High-Reliability Industries: Automotive electronics, aerospace, medical devices, and military hardware where zero defects are paramount.
Advanced Packaging: For processes like System-in-Package (SiP) and flip-chip where paste volume control is extremely sensitive.
Miniaturized Components: Essential for inspecting ultra-fine pitch components such as 01005 chips, microBGAs, and QFNs where printing defects are common and hard to see.
Lead-Free & Challenging Pastes: Inspecting the behavior of no-clean, lead-free, or high-viscosity solder pastes which can be harder to print consistently.
Process Monitoring & Optimization: Used as a core tool for SPC, providing data to optimize stencil design, printer parameters, and paste formulations, reducing rework costs and improving overall line efficiency.
Any SMT Line Aiming for "Zero Defect" Manufacturing: Implementing SPI is a foundational step towards a fully automated, data-driven smart factory (Industry 4.0) by providing the critical process feedback loop at the very first step of the SMT process.

Tags:

Products Details

Home > Products >

Pick And Place Machine

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

All Category

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

Brand Name:	Snicktek
MOQ:	1
Price:	$28,400

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Brand Name:

Snicktek

Machine Type:

SPI Equipment

Product Name:

3D SPI Automatic Machine

Type:

Automatic

Application:

SMT PCB Solder Paste Test

Usage:

SMD LED SMT

Minimum Order Quantity:

Price:

$28,400

Highlight:

High Speed Testing 3D SPI Machine

In-line Inspection Solder Paste Inspection Machine

Five Million Pixels Camera Automatic SPI Equipment

Product Description

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine

Key Features

High-Speed 3D Scanning Technology: Utilizes fast Moiré, phase-shift, or laser scanning to capture millions of data points in seconds, enabling sub-micron height resolution and high repeatability.
True Volumetric Measurement: Calculates the precise volume of each solder paste deposit, which is the most critical parameter for ensuring a reliable solder joint after reflow.
Ultra-Fast Throughput: High-speed cameras, optimized motion control, and efficient algorithms allow for cycle times often under 5-10 seconds per board, matching high-mix or high-volume production needs.
Automatic Programming & Alignment: Features like CAD import, automatic fiducial marking, and component library generation significantly reduce setup time for new products.
Closed-Loop Control Integration: Can communicate directly with solder paste printers (like DEK, Ekra, MPM) to automatically adjust stencil alignment, pressure, or squeegee speed to correct drifting processes in real-time.
Comprehensive Defect Detection: Identifies and classifies a wide range of paste printing defects including:
- Insufficient/Excessive Paste: Low volume/high volume.
- Height Variations: Bridges, insufficient height.
- Shape Defects: Skewing, smear, dog-ears, scooping.
- Presence/Absence: Missing deposits or gross misalignment.
User-Friendly Software: Intuitive GUI with SPC (Statistical Process Control) reporting, real-time dashboards, trend charts (Cp/Cpk), and detailed defect visualization for root cause analysis.
Robust Construction: Designed for 24/7 factory operation with stable granite bases, precision linear guides, and maintenance-friendly designs.

Technical Specifications

Technology Platform	Type-B/C	Type-B/C	Super large platform
Series	Hero/Ultra	Hero/Ultra	1.2m/1.5m series
Model	S8080/S2020/Hero/Ultra	S8080D/S2020D/HeroD/UltraD	L1200/DL1200/DL1500
Measurement Principle	3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Proﬁlometry)
Measurements	Volume, area, height, XY offset, shape
Detection of Non-Performing Types	Missing printing, insufficient tin, excessive tin, bridging tin, offset, poor shape, board surface pollution
Lens Resolution	4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um (Optional for different camera models)
Accuracy	XY (Resolution):10um
Repeatability	height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma);
Gage R&R	<<10%
Inspection Speed	0.35sec/FOV-0.5sec/FOV (Determined according to actual configuration)
Quanlity of Inspection Head	Standard 1, optional 2, 3
Mark-point Detection Time	0.3sec/piece
Maximun Meauring Head	±550um (±1200um as option)
Maximun Measuring Height of PCB Warp	±5mm
Minimun Pad Spacing	100um (pad height is 150um pad as reference) 80um/100um/150um/200um (determined according to actual configuration)
Minimum element	01005/03015/008004 (Optional)	01005/03015/008004 (Optional)	201
Maximun Loading PCB Size(X*Y)	450x500mm(B) 470x500mm (C) (Measurable range 630x550mm Large platform)	450x310+450x310(B) 470x310+470x310(C) 630x310+630x310 (Large platform )	1200x650mm (measurable range 1200x650mm one-stage) 600x2x650mm (Measurable range 1200x550mm two-stage)
Conveyor Setup	front orbit (back orbit as option)	1 front orbit , 2,3,4 Dynamic Orbit	front orbit (back orbit as option)
PCB Transfer Direction	Left to right or Right to left
Conveyor Width Adjustment	manual & automatic
SPC/Engineering Statistics	Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Import	Support Gerber format (274x, 274d), manual teach mode, CAD X/Y, Part No., Package Type, etc. import
Operating System Support	Windows 10 Professional (64 bit)
Equipment Diemension and Weight	W1000xD1150xH1530(B), 965Kg W1000xD1174xH1550(C), 985Kg	W1000xD1350xH1530(B) ,1200Kg W1000xD1350xH1550(C) ,1220Kg	W1730xD1420xH1530mm (one-stage), 1630Kg W1900xD1320xH1480mm two-stage), 1250Kg W2030xD1320xH1480(1500), 1450Kg
Optional	1 with multiple centralized control software, network SPC software, 1D/2D Barcode scanner, offline programming software, UPS uninterruptible power supply

Application

SINICTEK SPI machines are essential in modern electronics manufacturing where high first-pass yield is critical. Key application areas include:

High-Reliability Industries: Automotive electronics, aerospace, medical devices, and military hardware where zero defects are paramount.
Advanced Packaging: For processes like System-in-Package (SiP) and flip-chip where paste volume control is extremely sensitive.
Miniaturized Components: Essential for inspecting ultra-fine pitch components such as 01005 chips, microBGAs, and QFNs where printing defects are common and hard to see.
Lead-Free & Challenging Pastes: Inspecting the behavior of no-clean, lead-free, or high-viscosity solder pastes which can be harder to print consistently.
Process Monitoring & Optimization: Used as a core tool for SPC, providing data to optimize stencil design, printer parameters, and paste formulations, reducing rework costs and improving overall line efficiency.
Any SMT Line Aiming for "Zero Defect" Manufacturing: Implementing SPI is a foundational step towards a fully automated, data-driven smart factory (Industry 4.0) by providing the critical process feedback loop at the very first step of the SMT process.

Tags:

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

High Speed Testing 3D SPI Machine

In-line Inspection Solder Paste Inspection Machine

Five Million Pixels Camera Automatic SPI Equipment

Key Features

Application

LED Chip Mounter

smt placement machine

pick and place pcb assembly

Products Details

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine

3D Solder Paste Inspection High Speed Testing In-line SPI Automatic Machine Sinictek

High Speed Testing 3D SPI Machine

In-line Inspection Solder Paste Inspection Machine

Five Million Pixels Camera Automatic SPI Equipment

Key Features

Application