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High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment

High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment

Brand Name: RD
MOQ: 1
Price: $22,000
Detail Information
Place of Origin:
China
Machine Type:
Pick And Place Machine
Product Name:
Led Pick And Place Machine Price
Name:
SMD Pick And Place Machine
Function:
Surface Mount Equipment
Usage:
SMT Production Assembly Line
Marketing Type:
PCB Manufacturing Line
Application:
SMT LED Assembly Line
Highlight:

60000CPH Pick and Place Machine

,

Independent Camera Motor SMT Placement Machine

,

Three Section Track Transmission PCB Assembly Machine

Product Description
High-Precision SMT Pick and Place Machine for LED Applications
High-speed fully automatic SMD LED production line PCB fabrication equipment designed for efficient electronic component placement.
Product Overview
High-performance surface mount component placement equipment designed for LED DOB lighting, small household appliances, control panels, point light sources, and other electronic manufacturing applications.
High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment 0
Key Features

Each group of mounting heads independently controls the rotation angle, resulting in higher mounting efficiency. Each nozzle corresponds independently to a 1 megapixel flying camera for visual correction. Three section fixed track transmission, higher efficiency for mounting small-sized and fewer PCB boards. Suitable for: bulb, projection light, power supply, ceiling light, backlight, etc.

Technical Specifications
Model No RD-ZT8VA RD-ZT10VA
Number of mouning heads 8 heads 10 heads
Feeder Station 26 stations 26 stations
Oplinal plapement speed 50000 chips/h 60000 chips/h
Machine weight Approximately 1350KG Approximately 1600KG
Heght of Attachable
Components
<8mm
Maximum mounting plate size 800mm x 500mm (segmented patch,each segment can be pasted with 400mm)
1200mm × 500mm (segmented patch,each segment can be pasted with 600mm)
Edemal dimensions 1350mm long x1350mm wide×15D0mm high (Apply 800mm×500mm model)
1200mm long*1500mm wide×15D0mm hig (Apphy 1200mm×500mm model)
Substrate transfer method Three section track automatic transmission
Machine Syslem   Independenty deweloped operating system
Positioning method Visual automatic MARK points
Correction of suction eror
by flying swatter
  Each nozlze corresponds independently to a 1 megapixel flying camera visyal correction
Programming method Visual camera positioning programming / Excel format file coordinate import
Input power /voltage   AC220V /50HZ (opereting power approximately 2KW/H)
Mountable components Beads, resistors, capacitors, ICs, terminals, diodes, etc. above 0603

Advanced Vision System
Each placement head features an independent camera motor with dedicated lens/zoom components for on-the-fly alignment vision processing.
Parallel Vision Processing
All 12 placement heads simultaneously capture images and perform recognition calculations while in motion, eliminating waiting and queuing times.
True On-the-Fly Alignment
Component recognition is 100% synchronized with placement head movement. As heads move from pick-up to placement positions, built-in cameras complete component recognition, positioning, and angle calculations, achieving zero visual waiting time.
Automatic Nozzle Changing
Core technology enabling higher efficiency, intelligence, and flexibility in SMT production lines.
Production Efficiency Benefits
  • Fast nozzle changing within seconds without manual intervention
  • Continuous production supporting rapid product switching
  • Optimized placement cycles with automatic nozzle matching
Placement Head Configurations
8 Placement Head: Independently controlled rotation angle, 50,000 chips/hour
10 Placement Head: Independently controlled rotation angle, 60,000 chips/hour
Application Scope
Ideal for large, thick PCBs with high component density, including capacitors, resistors, inductors, fuses, terminal blocks, and large connectors. Primarily used in LED DOB lighting, LED drivers, and industrial control board production.

Good price  online

Products Details

Home > Products >
Pick And Place Machine
>
High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment

High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment

Brand Name: RD
MOQ: 1
Price: $22,000
Detail Information
Place of Origin:
China
Brand Name:
RD
Machine Type:
Pick And Place Machine
Product Name:
Led Pick And Place Machine Price
Name:
SMD Pick And Place Machine
Function:
Surface Mount Equipment
Usage:
SMT Production Assembly Line
Marketing Type:
PCB Manufacturing Line
Application:
SMT LED Assembly Line
Minimum Order Quantity:
1
Price:
$22,000
Highlight:

60000CPH Pick and Place Machine

,

Independent Camera Motor SMT Placement Machine

,

Three Section Track Transmission PCB Assembly Machine

Product Description
High-Precision SMT Pick and Place Machine for LED Applications
High-speed fully automatic SMD LED production line PCB fabrication equipment designed for efficient electronic component placement.
Product Overview
High-performance surface mount component placement equipment designed for LED DOB lighting, small household appliances, control panels, point light sources, and other electronic manufacturing applications.
High Speed Pick and Place Machine Fully Automatic Smd Led Production Line Pcb Fabrication Manufacturing Equipment 0
Key Features

Each group of mounting heads independently controls the rotation angle, resulting in higher mounting efficiency. Each nozzle corresponds independently to a 1 megapixel flying camera for visual correction. Three section fixed track transmission, higher efficiency for mounting small-sized and fewer PCB boards. Suitable for: bulb, projection light, power supply, ceiling light, backlight, etc.

Technical Specifications
Model No RD-ZT8VA RD-ZT10VA
Number of mouning heads 8 heads 10 heads
Feeder Station 26 stations 26 stations
Oplinal plapement speed 50000 chips/h 60000 chips/h
Machine weight Approximately 1350KG Approximately 1600KG
Heght of Attachable
Components
<8mm
Maximum mounting plate size 800mm x 500mm (segmented patch,each segment can be pasted with 400mm)
1200mm × 500mm (segmented patch,each segment can be pasted with 600mm)
Edemal dimensions 1350mm long x1350mm wide×15D0mm high (Apply 800mm×500mm model)
1200mm long*1500mm wide×15D0mm hig (Apphy 1200mm×500mm model)
Substrate transfer method Three section track automatic transmission
Machine Syslem   Independenty deweloped operating system
Positioning method Visual automatic MARK points
Correction of suction eror
by flying swatter
  Each nozlze corresponds independently to a 1 megapixel flying camera visyal correction
Programming method Visual camera positioning programming / Excel format file coordinate import
Input power /voltage   AC220V /50HZ (opereting power approximately 2KW/H)
Mountable components Beads, resistors, capacitors, ICs, terminals, diodes, etc. above 0603

Advanced Vision System
Each placement head features an independent camera motor with dedicated lens/zoom components for on-the-fly alignment vision processing.
Parallel Vision Processing
All 12 placement heads simultaneously capture images and perform recognition calculations while in motion, eliminating waiting and queuing times.
True On-the-Fly Alignment
Component recognition is 100% synchronized with placement head movement. As heads move from pick-up to placement positions, built-in cameras complete component recognition, positioning, and angle calculations, achieving zero visual waiting time.
Automatic Nozzle Changing
Core technology enabling higher efficiency, intelligence, and flexibility in SMT production lines.
Production Efficiency Benefits
  • Fast nozzle changing within seconds without manual intervention
  • Continuous production supporting rapid product switching
  • Optimized placement cycles with automatic nozzle matching
Placement Head Configurations
8 Placement Head: Independently controlled rotation angle, 50,000 chips/hour
10 Placement Head: Independently controlled rotation angle, 60,000 chips/hour
Application Scope
Ideal for large, thick PCBs with high component density, including capacitors, resistors, inductors, fuses, terminal blocks, and large connectors. Primarily used in LED DOB lighting, LED drivers, and industrial control board production.