|
|
| Brand Name: | HXT |
| Model Number: | ZD4530F |
| MOQ: | 1 |
| Price: | 2000 |
| Packaging Details: | Vacuum packing plus wooden box packing |
| Payment Terms: | T/T |
Advantages compared to hand dipping and foaming:
Instructions for use
![]()
|
Product Parameters |
|
|
Model: |
ZD4530F |
|
Solder paste temperature: |
0-350℃ |
|
Solder paste capacity: |
75KG |
|
Power supply: |
AC220V 50HZ |
|
Power: |
4.5KW |
|
Solder paste furnace tank size: |
450mm x 300mm x 75mm |
|
Dial area: |
390mm x 260mm x 30mm |
|
Overall size: |
750mm x 530mm x 1380mm |
|
Weight: |
80KG |
![]()
![]()
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
![]()
|
| Brand Name: | HXT |
| Model Number: | ZD4530F |
| MOQ: | 1 |
| Price: | 2000 |
| Packaging Details: | Vacuum packing plus wooden box packing |
| Payment Terms: | T/T |
Advantages compared to hand dipping and foaming:
Instructions for use
![]()
|
Product Parameters |
|
|
Model: |
ZD4530F |
|
Solder paste temperature: |
0-350℃ |
|
Solder paste capacity: |
75KG |
|
Power supply: |
AC220V 50HZ |
|
Power: |
4.5KW |
|
Solder paste furnace tank size: |
450mm x 300mm x 75mm |
|
Dial area: |
390mm x 260mm x 30mm |
|
Overall size: |
750mm x 530mm x 1380mm |
|
Weight: |
80KG |
![]()
![]()
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
![]()