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Home > Products >
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Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection
All Category

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine
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Miss. Alina
alina@hxt-smt.com
+86 16620793861
wechat +86 16620793861
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Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Brand Name: rmi
Model Number: X-7900
MOQ: 1
Price: US$ 23000
Packaging Details: Wodden box
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Guangdong, China
Certification:
CE
Weight:
1050kg
Voltage:
AC110-220V 50-60HZ
Spatial Resolution:
3 μm
Tube Voltage:
130kv
Tube Current:
300μA
Imaging Precision:
Flat-panel Digital
A/D Convert Density:
16bit (65536)
DPI:
1536*1536px
Frame Frequency:
20 FPS
Optical Magnification:
450X
System Magnification:
2000X
Power:
1200W
Machine size:
L1098 X W1389 X H2157mm
Supply Ability:
1000 unit / month
Highlight:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

Product Description
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

✅ Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

✅ Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

✅ Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

✅ User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

✅ Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications

  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?

  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes

  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support

Tags: 

LED Light Testing Machine  

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pcb handling conveyor

Good price online

Products Details

Home > Products >
Electronics Production Machinery
>
Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection
All Category

Pick And Place Machine

Reflow Oven

SMT AOI Machine

SMT Solder Paste Printing Machine

SMT SPI Machine

SMT Machine Line

Automatic Insertion Machine

Wave Soldering Machine

SMT Loader Unloader Machine

SMT Conveyor

Glue Dispensing Machine

Conformal Coating Machine

Curing Oven Machine

PCB Cutting Machine

Electronics Production Machinery

PCB Machine
name
  • name
  • name
  • name
  • name
  • name
  • name

Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Brand Name: rmi
Model Number: X-7900
MOQ: 1
Price: US$ 23000
Packaging Details: Wodden box
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
rmi
Certification:
CE
Model Number:
X-7900
Weight:
1050kg
Voltage:
AC110-220V 50-60HZ
Spatial Resolution:
3 μm
Tube Voltage:
130kv
Tube Current:
300μA
Imaging Precision:
Flat-panel Digital
A/D Convert Density:
16bit (65536)
DPI:
1536*1536px
Frame Frequency:
20 FPS
Optical Magnification:
450X
System Magnification:
2000X
Power:
1200W
Machine size:
L1098 X W1389 X H2157mm
Minimum Order Quantity:
1
Price:
US$ 23000
Packaging Details:
Wodden box
Delivery Time:
10-15 days
Payment Terms:
T/T
Supply Ability:
1000 unit / month
Highlight:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

Product Description
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

✅ Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

✅ Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

✅ Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

✅ User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

✅ Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications

  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?

  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes

  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support

Tags: 

LED Light Testing Machine

Infrared BGA Rework Station

pcb handling conveyor

+86 16620793861
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+86 16620793861
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