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High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Brand Name: HXT
Model Number: SH-110-2D
MOQ: 1
Price: 1200
Packaging Details: Wodden box
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
CE
Measurement Accuracy:
±0.001 Mm (±1 µm)
Repeat Accuracy:
±0.002 Mm (±2 µm)
Base Dimensions:
320 Mm * 500 Mm * 360 Mm
Optical Magnification:
25* – 110* (5-step Adjustable)
Image Resolution:
600 * 480 Pixels
Weight:
30 Kg
Supply Ability:
1000 per month
Product Description
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.

Good price  online

Products Details

Home > Products >
SMT SPI Machine
>
High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Brand Name: HXT
Model Number: SH-110-2D
MOQ: 1
Price: 1200
Packaging Details: Wodden box
Payment Terms: T/T
Detail Information
Place of Origin:
China
Brand Name:
HXT
Certification:
CE
Model Number:
SH-110-2D
Measurement Accuracy:
±0.001 Mm (±1 µm)
Repeat Accuracy:
±0.002 Mm (±2 µm)
Base Dimensions:
320 Mm * 500 Mm * 360 Mm
Optical Magnification:
25* – 110* (5-step Adjustable)
Image Resolution:
600 * 480 Pixels
Weight:
30 Kg
Minimum Order Quantity:
1
Price:
1200
Packaging Details:
Wodden box
Delivery Time:
30 Days
Payment Terms:
T/T
Supply Ability:
1000 per month
Product Description
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.