| MOQ: | 1 |
| Price: | $3,900 |
A Lead-Free Wave Soldering Machine is a specialized industrial machine used in electronics manufacturing to solder through-hole components onto printed circuit boards (PCBs) using solder alloys that contain no lead.
It's a direct evolution of traditional wave soldering machines, adapted to meet environmental regulations (like the EU's RoHS directive) that restrict the use of hazardous lead in electronics.
|
Model
|
S1320M
|
|
Number of crests
|
2 crests
|
|
PCB board width
|
Max200mm
|
|
Tin furnace capacity
|
135KG
|
|
Preheating length
|
400mm
|
|
Peak height
|
12mm
|
|
Foot length of board components
|
10mm
|
|
PCB board transportation height
|
750±20mm
|
|
Total power
|
6KW
|
|
Power supply
|
380V 50HZ
|
|
Control method
|
Touch screen
|
|
Rack size
|
1300*1050*1350mm
|
|
Dimensions
|
2100*1050*1450mm
|
|
PCB board transportation speed
|
0-1.2m/min
|
|
Preheating zone temperature
|
Room temperature -180°C
|
|
Heating method
|
Hot air
|
|
Cooling method
|
Axial fan cooling
|
|
Tin furnace temperature
|
Room temperature—300℃
|
|
Transport direction
|
left→right
|
|
Temperature control method
|
PID+SSR
|
|
The whole machine control method
|
Mitsubishi PKC+ touch screen
|
|
Flux capacity
|
Max5.2L
|
|
Spray method
|
Stepper motor+ST-6
|
|
Power supply
|
3-phase 5-wire system 380V50HZ
(can also be changed to 220V)
|
|
Gas source
|
4-7KG/CM2 12.5L/Min
|
|
Weight
|
400KG
|
The Basic Process Flow:
Flux Application: The PCB bottom is sprayed with flux to clean oxides and prepare surfaces.
Preheating: The board is gradually heated to avoid thermal shock and activate the flux.
Soldering: The board passes over the molten lead-free solder wave, making contact.
Cooling: The board cools to solidify the joints.
Applications:
For electronic componenets soldering on PCB board assembling.
![]()
| MOQ: | 1 |
| Price: | $3,900 |
A Lead-Free Wave Soldering Machine is a specialized industrial machine used in electronics manufacturing to solder through-hole components onto printed circuit boards (PCBs) using solder alloys that contain no lead.
It's a direct evolution of traditional wave soldering machines, adapted to meet environmental regulations (like the EU's RoHS directive) that restrict the use of hazardous lead in electronics.
|
Model
|
S1320M
|
|
Number of crests
|
2 crests
|
|
PCB board width
|
Max200mm
|
|
Tin furnace capacity
|
135KG
|
|
Preheating length
|
400mm
|
|
Peak height
|
12mm
|
|
Foot length of board components
|
10mm
|
|
PCB board transportation height
|
750±20mm
|
|
Total power
|
6KW
|
|
Power supply
|
380V 50HZ
|
|
Control method
|
Touch screen
|
|
Rack size
|
1300*1050*1350mm
|
|
Dimensions
|
2100*1050*1450mm
|
|
PCB board transportation speed
|
0-1.2m/min
|
|
Preheating zone temperature
|
Room temperature -180°C
|
|
Heating method
|
Hot air
|
|
Cooling method
|
Axial fan cooling
|
|
Tin furnace temperature
|
Room temperature—300℃
|
|
Transport direction
|
left→right
|
|
Temperature control method
|
PID+SSR
|
|
The whole machine control method
|
Mitsubishi PKC+ touch screen
|
|
Flux capacity
|
Max5.2L
|
|
Spray method
|
Stepper motor+ST-6
|
|
Power supply
|
3-phase 5-wire system 380V50HZ
(can also be changed to 220V)
|
|
Gas source
|
4-7KG/CM2 12.5L/Min
|
|
Weight
|
400KG
|
The Basic Process Flow:
Flux Application: The PCB bottom is sprayed with flux to clean oxides and prepare surfaces.
Preheating: The board is gradually heated to avoid thermal shock and activate the flux.
Soldering: The board passes over the molten lead-free solder wave, making contact.
Cooling: The board cools to solidify the joints.
Applications:
For electronic componenets soldering on PCB board assembling.
![]()