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Brand Name: | DCEN |
Model Number: | DC-500 |
MOQ: | 1 |
Price: | 11200 |
Packaging Details: | Vacuum packing plus wooden box packing |
Payment Terms: | T/T |
The Offline 2D AOI (Automated Optical Inspection) Machine is a cost-effective quality control solution designed for post-production PCB inspection in small-to-medium batch manufacturing. Utilizing high-resolution 2D imaging (5MP-20MP cameras) with multi-angle LED illumination, this standalone system detects solder defects (bridging, insufficient solder), component errors (missing/misaligned parts), and polarity issues with 15μm resolution.
Optical system |
Optical camera |
5 million high-speed intelligent digital industrial camera |
Resolution (FOV) |
Standard 15μm/Pixel (corresponding FOV: 38mm*30mm) 10/15/20μm/Pixel (optional) |
|
Optical lens |
5M pixel level telecentric lens, depth of field: 8mm-10mm |
|
Light source system |
High brightness RGB coaxial ring multi-angle LED light source |
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Hardware Configuration |
Operating system |
Windows 10 Professional |
Computer Configuration |
i3CPU, 8G GPU graphics card, 16G memory, 120G solid state drive, 1TB mechanical hard drive |
|
machine power |
AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW |
|
Machine size |
1100mm×900mm×1350mm (L × W × H) height including feet |
|
Machine weight |
450kg |
|
Optional configuration |
Off-line programming software, external barcode gun MES traceability system interface is open |
|
|
|
|
Detect PCB specifications |
Size |
40×40mm ~450×330mm (larger size can be customized according to customer requirements) |
thickness |
0.3mm ~6mm |
|
Board weight |
≤3KG |
|
Clear height |
Upper net height ≤ 35mm, lower net height ≤ 70mm (special requirements can be customized) |
|
Minimum test element |
0201 components, 0.3 mm pitch and above IC (optional can reach 01005 components) |
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|
|
Test items |
Solder paste printing |
Presence, deflection, less tin, more tin, open circuit, pollution, tin connection, etc. |
Part Defect |
Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damaged parts, multiple parts, etc. |
|
Solder joint defects |
Less tin, more tin, even tin, virtual soldering, multiple pieces, etc. |
|
Wave Soldering Inspection |
Insert pin, no tin, less tin, more tin, virtual soldering, tin bead, tin hole, open circuit, multiple pieces, etc. |
|
Red plastic board detection |
Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damage, overflowing glue, multiple parts, etc. |
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
![]() |
Brand Name: | DCEN |
Model Number: | DC-500 |
MOQ: | 1 |
Price: | 11200 |
Packaging Details: | Vacuum packing plus wooden box packing |
Payment Terms: | T/T |
The Offline 2D AOI (Automated Optical Inspection) Machine is a cost-effective quality control solution designed for post-production PCB inspection in small-to-medium batch manufacturing. Utilizing high-resolution 2D imaging (5MP-20MP cameras) with multi-angle LED illumination, this standalone system detects solder defects (bridging, insufficient solder), component errors (missing/misaligned parts), and polarity issues with 15μm resolution.
Optical system |
Optical camera |
5 million high-speed intelligent digital industrial camera |
Resolution (FOV) |
Standard 15μm/Pixel (corresponding FOV: 38mm*30mm) 10/15/20μm/Pixel (optional) |
|
Optical lens |
5M pixel level telecentric lens, depth of field: 8mm-10mm |
|
Light source system |
High brightness RGB coaxial ring multi-angle LED light source |
|
|
|
|
Hardware Configuration |
Operating system |
Windows 10 Professional |
Computer Configuration |
i3CPU, 8G GPU graphics card, 16G memory, 120G solid state drive, 1TB mechanical hard drive |
|
machine power |
AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW |
|
Machine size |
1100mm×900mm×1350mm (L × W × H) height including feet |
|
Machine weight |
450kg |
|
Optional configuration |
Off-line programming software, external barcode gun MES traceability system interface is open |
|
|
|
|
Detect PCB specifications |
Size |
40×40mm ~450×330mm (larger size can be customized according to customer requirements) |
thickness |
0.3mm ~6mm |
|
Board weight |
≤3KG |
|
Clear height |
Upper net height ≤ 35mm, lower net height ≤ 70mm (special requirements can be customized) |
|
Minimum test element |
0201 components, 0.3 mm pitch and above IC (optional can reach 01005 components) |
|
|
|
|
Test items |
Solder paste printing |
Presence, deflection, less tin, more tin, open circuit, pollution, tin connection, etc. |
Part Defect |
Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damaged parts, multiple parts, etc. |
|
Solder joint defects |
Less tin, more tin, even tin, virtual soldering, multiple pieces, etc. |
|
Wave Soldering Inspection |
Insert pin, no tin, less tin, more tin, virtual soldering, tin bead, tin hole, open circuit, multiple pieces, etc. |
|
Red plastic board detection |
Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damage, overflowing glue, multiple parts, etc. |
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.